PCB Fabrication
Capabilities
Experienced employees, state-of-the-art technologies, professional appliances and used quality management system ISO 9001:2000 ensure that the services offered by the company are at the highest global level.
| Item | Capability | |
| Material type | FR4 | FR4, High TG FR4, Halogen free FR4, high speed FR4 |
| Polymide | Dupont Pyralux AP/TK series, Panasonic “FELIOS” series | |
| Metal based | Aluminum based, Copper based, special alloys based, Laird 1KA04,1KA06, Bergquist MP06503, HT0450 | |
| Microwave & RF | Rogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N, Nelco N4000-13, Panasonic Megtron 4,Megtron 6, Taconic RF35, TUC TU872, EMC EM827 | |
| Feature | Layers counts | 1-40 layers |
| Board thickness | 0.13-7.0mm | |
| max. board size | 21×59 inch | |
| Layup | blind/buried vias | mechanical drill, laser drill, stacked vias available |
| HDI | i+N+i(i>=1),epoxy fill, copper fill,electrochemical plating | |
| Surface finish | Surface treatment | HAL with lead, lead free HAL, flash gold, ENIG, immersion silver, immersion tin, OSP, hard gold plating, hard gold connector, ENEPIG, peelable mask, carbon ink, silver ink |
| Drill | max. Aspect ratio | Max aspect ratio: 16:1(drill >=0.2mm) |
| min. drill position tolerance | ±2mil | |
| PTH tolerance | ±3mil | |
| press fit hole tolerance | ±2mil | |
| NPTH tolerance | ±2mil | |
| min. drill | mechanical drill: 0.15mm; laser drill: 0.1mm | |
| back drill size | 0.5-6.5mm | |
| slot tolerance | ±0.15mm | |
| PAD | min. pad for laser drill | 10mil |
| min. pad for mechanical drill | 14mil | |
| BGA pad | >=7mil | |
| min. PAD tolerance | +5%; -10% | |
| Min. trace width/clearance | inner layers | 1/3,1/2OZ:3/3mil |
| 1OZ:3/4 mil | ||
| 2OZ:5/5 mil | ||
| 3OZ:6/7 mil | ||
| 4OZ:7/11 mil | ||
| 5OZ:10/16 mil | ||
| out layers | 1/3OZ:3/3 mil | |
| 1/2OZ:3.5/3.5 mil | ||
| 1OZ:4.5/5 mil | ||
| 2OZ:6/8 mil | ||
| 3OZ:8/14 mil | ||
| 4OZ:10/16 mil | ||
| 5OZ:12/20 mil | ||
| tolerance | <=10mil: ±1.0mil | |
| >10mil:±1.5mil | ||
| Min. spacing | drill to trace (blind/buried via) | 9mil( 2 or 3 time pressing) |
| drill to trace (no blind/buried via) | 6mil(<= 8 layer), 8mil(<= 14 layer), 9mil(<= 28 layer) | |
| laser drill to trace(1-3 times pressing) | 6mil | |
| outline to trace | 8mil | |
| V-CUT line to trace (mm) | H<= 1.0mm:0.3(20°),0.33(30°),0.37(45°),0.42(60°) | |
| 1.0<H<= 1.6mm:0.36(20°),0.4(30°),0.5(45°),0.6(60°) | ||
| 1.6<H<= 2.4mm:0.42(20°),0.51(30°),0.64(45°),0.8(60°) | ||
| 2.5<H<= 3.0mm:0.47(20°),0.59(30°),0.77(45°),0.97(60°) | ||
| inner layer copper separate spacing | 8mil | |
| outline to inner layer copper | 8mil | |
| chamfer to gold finger | 7mil | |
| PAD to PAD distance (ENIG) | 4mil | |
| spacing between gold fingers | 6mil | |
| PAD to PAD distance (HAL) | 7mil (to main copper 10mil) | |
| peelbale mask to PAD | 16mil | |
| silkscreen to PAD | 6mil | |
| between carbon ink | 15mil | |
| Others | min. distance between inner layers | 2mil(without blind/buried via); 5mil(with blind/buried via) |
| layer to layer misalignment | <= 5mil | |
| board thickness tolerance | board thickness<= 1.0mm: ±0.1mm | |
| board thickness>1.0mm: ±10% | ||
| special(no layup requirement):thickness <= 2.0mm ±0.1mm; thickness 2.1-3.0 ±0.15mm | ||
| impedance tolerance | ±5Ω(<50Ω),±10%(>= 50Ω);>=50Ω max.±5% | |
| outline tolerance | ±0.13mm, max. +/-0.1mm | |
| outline position tolerance | ±0.1mm | |
| bow & twist | 0.7%, max.0.1% | |
| max. inner layer copper thickness | 10 OZ | |
| max. inner layer copper thickness | 15OZ | |
| min prepreg thickness | 2mil(0.5oz copper) | |
| min silkscreen width and height | width: 4mil; height: 20mil | |
| min. inner radius | 0.3mm | |
| min.V-CUT angle tolerance | ±5° | |
| min.V-CUT symmetry tolerance | ±4mil | |
| min.V-CUT remaince tolerance | ±4mil | |
| min solder mask dam | 4mil(green),5mil(other color)(base cu<=1OZ) (cu thickness 2-4OZ,need 6mil) | |
| solder mask color | green, black, blue, red, white, grey, purple | |
| silkscreen color | white, black, yellow,green | |
| min chamfer angle tolerance | ±5° | |
| min chamfer remaince tolerance | ±5mil | |
| Max. e-testing voltage | 500V | |
| Max. e-testing current | 200mA | |
Engine Servicing
Vestibulum id ligula porta felis euismod semper libero a pharetra augue. Lorem ipsum dolor sit amet, consectetur adipiscing elit.
Car Reconditioning
Vestibulum id ligula porta felis euismod semper libero a pharetra augue. Lorem ipsum dolor sit amet, consectetur adipiscing elit.
Car Repairing
Vestibulum id ligula porta felis euismod semper libero a pharetra augue. Lorem ipsum dolor sit amet, consectetur adipiscing elit.
Popular Services
Donec id elit non mi porta gravida at egeum sociis natoque penatibus et magnis dis
Our Pricing
Collision Repairs
Nullam id dolor id nibh ultricies vehicula ut id elit. Praesent commodo cursus magna, vel scelerisque nisl consectetur et
Nullam / Nibh ultricies / Vehicula / Praesent / Scelerisque / Consectetur et
$400 /hr.
Starts from
Smog Check & Oil Change
Nullam id dolor id nibh ultricies vehicula ut id elit. Praesent commodo cursus magna, vel scelerisque nisl consectetur et
Nullam / Nibh ultricies / Vehicula / Praesent / Scelerisque / Consectetur et
$40 /hr.
Starts from
Tire Services
Nullam id dolor id nibh ultricies vehicula ut id elit. Praesent commodo cursus magna, vel scelerisque nisl consectetur et
Nullam / Nibh ultricies / Vehicula / Praesent / Scelerisque / Consectetur et
$48 /hr.
Starts from
Engine Services
Nullam id dolor id nibh ultricies vehicula ut id elit. Praesent commodo cursus magna, vel scelerisque nisl consectetur et
Nullam / Nibh ultricies / Vehicula / Praesent / Scelerisque / Consectetur et
$480 /hr.
Starts from
Happy Customers
“Donec id elit non mi porta gravida at eget Duis mollis, est non commodo luctus, nisi erat porttitor ligula, eget lacinia odio sem nec elit. Donec ullamcorper nulla tellusper nulla tellus ac cursus commodo tortor mauris condimentum nibh”
Joel Marshall
“Donec id elit non mi porta gravida at eget Duis mollis, est non commodo luctus, nisi erat porttitor ligula, eget lacinia odio sem nec elit. Donec ullamcorper nulla tellusper nulla tellus ac cursus commodo tortor mauris condimentum nibh”
