PCB Fabrication

 

Capabilities

Experienced employees, state-of-the-art technologies, professional appliances and used quality management system ISO 9001:2000 ensure that the services offered by the company are at the highest global level.

Viasion supply a wide range of PCB technologies; please refer to Our PCB production capability as following:
ItemCapability
Material typeFR4FR4, High TG FR4, Halogen free FR4, high speed FR4
PolymideDupont Pyralux AP/TK series, Panasonic “FELIOS” series
Metal basedAluminum based, Copper based,  special alloys based,
Laird 1KA04,1KA06, Bergquist MP06503, HT0450
Microwave & RFRogers RO4350, RO4003, RO3003, RT/duroid, Arlon 85N, 33N,
Nelco N4000-13, Panasonic Megtron 4,Megtron 6,
Taconic RF35, TUC TU872, EMC EM827
FeatureLayers counts1-40 layers
Board thickness0.13-7.0mm
max. board size21×59 inch
Layupblind/buried viasmechanical drill, laser drill, stacked vias available
HDIi+N+i(i>=1),epoxy fill, copper fill,electrochemical plating
Surface finishSurface treatmentHAL with lead, lead free HAL, flash gold, ENIG, immersion silver,
immersion tin, OSP, hard gold plating, hard gold connector,
ENEPIG, peelable mask, carbon ink, silver ink
Drillmax. Aspect ratioMax aspect ratio: 16:1(drill >=0.2mm)
min. drill position tolerance±2mil
PTH tolerance±3mil
press fit hole tolerance±2mil
NPTH tolerance±2mil
min. drillmechanical drill: 0.15mm; laser drill: 0.1mm
back drill size0.5-6.5mm
slot tolerance±0.15mm
PADmin. pad for laser drill10mil
min. pad for mechanical drill14mil
BGA pad>=7mil
min. PAD tolerance  +5%;  -10%
Min. trace width/clearanceinner layers1/3,1/2OZ:3/3mil
1OZ:3/4 mil
2OZ:5/5 mil
3OZ:6/7 mil
4OZ:7/11 mil
5OZ:10/16 mil
out layers1/3OZ:3/3 mil
1/2OZ:3.5/3.5 mil
1OZ:4.5/5 mil
2OZ:6/8 mil
3OZ:8/14 mil
4OZ:10/16 mil
5OZ:12/20 mil
tolerance<=10mil: ±1.0mil
>10mil:±1.5mil
Min. spacingdrill to trace (blind/buried via)9mil( 2 or 3 time pressing)
drill to trace (no blind/buried via)6mil(<= 8 layer), 8mil(<=  14 layer), 9mil(<=  28 layer)
laser drill to trace(1-3 times pressing)6mil
outline to trace8mil
V-CUT line to trace (mm)H<= 1.0mm:0.3(20°),0.33(30°),0.37(45°),0.42(60°)
1.0<H<= 1.6mm:0.36(20°),0.4(30°),0.5(45°),0.6(60°)
1.6<H<= 2.4mm:0.42(20°),0.51(30°),0.64(45°),0.8(60°)
2.5<H<= 3.0mm:0.47(20°),0.59(30°),0.77(45°),0.97(60°)
inner layer copper separate spacing8mil
outline to inner layer copper8mil
chamfer to gold finger7mil
PAD to PAD distance (ENIG)4mil
spacing between gold fingers6mil
PAD to PAD distance (HAL)7mil (to main copper 10mil)
peelbale mask to PAD16mil
silkscreen to PAD6mil
between carbon ink15mil
Othersmin. distance between inner layers2mil(without blind/buried via); 5mil(with blind/buried via)
layer to layer misalignment<= 5mil
board thickness toleranceboard thickness<= 1.0mm: ±0.1mm
board thickness>1.0mm: ±10%
special(no layup requirement):thickness <= 2.0mm ±0.1mm;
thickness 2.1-3.0 ±0.15mm
impedance tolerance±5Ω(<50Ω),±10%(>= 50Ω);>=50Ω max.±5%
outline tolerance±0.13mm, max. +/-0.1mm
outline position tolerance±0.1mm
bow & twist0.7%, max.0.1%
max. inner layer copper thickness10 OZ
max. inner layer copper thickness15OZ
min prepreg thickness2mil(0.5oz copper)
min silkscreen width and heightwidth: 4mil; height: 20mil
min. inner radius0.3mm
min.V-CUT angle tolerance±5°
min.V-CUT symmetry tolerance±4mil
min.V-CUT remaince tolerance±4mil
min solder mask dam4mil(green),5mil(other color)(base cu<=1OZ)
(cu thickness 2-4OZ,need 6mil)
solder mask colorgreen, black, blue, red, white, grey, purple
silkscreen colorwhite, black, yellow,green
min chamfer angle tolerance±5°
min chamfer remaince tolerance±5mil
Max. e-testing voltage500V
Max. e-testing current200mA

Engine Servicing

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Car Reconditioning

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Car Repairing

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Popular Services

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Oil Change & Smog Test

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Tire Fills & Replacements

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Inspections & Tune Ups

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Cleaning & Detailing

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Engine Services

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Purchase Tools & Parts

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Our Pricing

Collision Repairs

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$400 /hr.

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Smog Check & Oil Change

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$40 /hr.

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Tire Services

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$48 /hr.

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Engine Services

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$480 /hr.

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Happy Customers

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Joel Marshall

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Jane Doe